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PM Modi Breaks Ground for ₹3,700-Crore HCL–Foxconn Semiconductor Plant in Jewar.

On Saturday, February 21, 2026, Prime Minister Narendra Modi participated in the groundbreaking ceremony for India Chip Private Limited, a 60:40 joint venture between the HCL Group and Foxconn (Hon Hai Technology Group).

Located at the Yamuna Expressway Industrial Development Authority (YEIDA) in Jewar, Greater Noida, this Outsourced Semiconductor Assembly and Test (OSAT) facility is a critical component of the India Semiconductor Mission (ISM) 2.0.


Project Blueprint: The Jewar Semiconductor Hub

The facility is strategically positioned near the upcoming Noida International Airport to leverage high-speed logistics for global exports.


Economic & Strategic Impact

This is the sixth major semiconductor unit approved under the national mission, marking North India’s first significant entry into the chip-making landscape.


Leadership Perspectives

“Developed India will be possible only if it is self-reliant. ‘Made in India’ chips are the backbone of a Viksit Bharat, powering everything from AI and 6G to Defense and EVs.” — Narendra Modi, Prime Minister of India.

“This JV is a great example of how we build, operate, and localize in India. We are thankful to our partner HCL and the government for this milestone.” — Young Liu, Chairman, Foxconn.


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